PCB-4 layer

PCB-4 layer
Price: US $ 1 - 99

Board Thickness:1.6MM
Min. Hole Size:0.1MM
Min. Line Width:0.15MM
Min. Line Spacing:0.17MM
Copper Thickness:2OZ
Surface Finishing:ENIG
Base Material:FR-4
Place of Origin:China
Model Number:SZJB 9IUOP
Brand Name:EJI

Products Details:

Material: FR-4,Layer: 4 layerSurface finish: HAL lead freeSolder mask; GreenSilk screen: WhiteThe othere surface finish we could do are; Gold finger, OSP, ENIG, HAL, Gold plating, Chemical silver, etc.The other solder mask type we could do are: Green, yellow, white, black, red, purpleplace sample order:3-5days
mass production:7-9 days(the first time should add 2-3 days)Our PCB capability:Material used: FR4, High Tg Minimum 170C, Hifrequency, Metal based: Aluminium ect.Maximum Panel Size: 26" X 26" (660mm X 660mm)Line Width & Spacing: Minimum Line Width (Internal) 4 mil (0.1 mm) for mass production and 3mil for samplesMinimum Line Width (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.Minimum Line Spacing (External): 4 mil (0.1 mm) for mass production and 3 mils for samples.Layer Count & Thickness: 2-12 layersMinimum Thickness (2 Layers): 4 mil (0.1 mm)Minimum Thickness (4 Layers): 12 mil (0.3 mm)Minimum Thickness (6 Layers): 16 mil (0.4 mm)Minimum Thickness (8 Layers): 24 mil (0.6 mm)Maximum Thickness(10layers): 200 mil (5.0 mm)Layer to Layer Registration: +/- 5 mil (0.13 mm)Via / Drill Size: Minimum Drill Hole Diameter 10 mil (0.25 mm)Minimum Via Size: 8 mil (0.2 mm)Hole to Hole Tolerance: +/- 3 mil (0.08 mm)Hole to Edge Tolerance: +/- 5 mil (0.13 mm)Micro Via: 4 mil (0.1 mm)Solder Mask: Solder Mask Bridge Between Solder Dam 3 mil (0.07 mm)Warpage: 0.5 %Impedance: +/- 10%Surface Finish: Hard Gold / ENIG / HASL / Carbon Ink / OSP (ENTEK CU 106 AX) / Immersion TinMin. SMT Ptich: 12 mil (0.2 mm)Min. parts footpins: 0201Products involved fields: consume Electronics, Medical equipments, Industrial commands, communications, auto parts ect.

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